Nickel 205 is similar to Nickel 200, but has compositional adjustments
to enhance its performance in electrical and electronic applications.
 
 

Applications include:

  • Anodes and grids of electronic valves
  • Lead wires
  • Ttransistor Housings
  • Magneto-strictive Transducers
     
Approximate Chemical Composition
Ni 99% min
Mg 0.01 - 0.08%
Ti 0.01 - 0.05%
DENSITY 8.89 g/cm3 0.321 lb/in3
MELTING POINT 1446oC 2635oF
COEFFICIENT OF EXPANSION 13.3 µm/m °C
( 20 - 100°C)		 7.4 x 10-6 in/in °F
( 70 - 212°F)
MODULUS OF RIGIDITY 82 kN/m2 11893 ksi
MODULUS OF ELASTICITY 207 kN/m2 30000 ksi
 

ELECTRICAL RESISTIVITY
9.5 μW • cm 57 ohm • circ mil/ft

THERMAL CONDUCTIVITY
75 W/m • oC 520 btu • in/ft2 • h • oF
 
CONDITION  

APPROX TENSILE STRENGTH

  

APPROX SERVICE TEMPERATURE
Annealed 400-500 N/mm2 58 - 73 ksi Tensile strength and elongation drop significantly at temperatures above 315°C (600°F). Service temperature is dependent on environment, load and size range.
Hard Drawn 700-900 N/mm2 102 - 131 ksi
 
STANDARDS
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